The SMD components above MSL2a are exposed to the atmosphere after being unsealed from the dry package. If they are not assembled within a limited time, they will absorb the moisture in the atmosphere and exceed the permissible range. Under this condition, the high temperature generated during welding will penetrate into the SMD. Evaporation of water vapor creates sufficient pressure to swell, lining the packaged plastic from the chip or leadframe, and chip damage and internal cracks that are attached to the leads. In extreme cases, the cracks extend to the surface of the SMD and even cause SMD to swell. And burst, this is the so-called popcorn phenomenon.
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